Advantages
- Capable of handling varying sizes of LED component packages
- Supports panels sized between 100 mm × 100 mm and 450 mm × 320 mm, with thicknesses from 2 mm to 3 mm
- Integrated with two camera systems for 2D and 3D deviation detection
- Inspects each LED’s X, Y, Z positions, tilt, rotation, and 3D thickness
- Optimized camera readability for 2D matrix barcodes
- Adjustable camera lighting to accommodate different locations of 2D matrix barcodes
- Optional: Two sets of 3D profilers
- Area of inspection: 66 mm × 50 mm
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Camera: 50 MP (with optional extended resolutions of 199 MP and 428 MP)
- Dual-Camera System Integration
Combines a high-resolution 2D vision system with dual 3D profiler modules to deliver comprehensive inspection and metrology capabilities. - Flexible Vision System Integration
Combines a high-resolution 2D vision system with optional dual 3D profiler modules, allowing top and bottom coverage to eliminate inspection blind spots across complex component geometries.
- Advanced 3D & XYZ Measurement
Accurately measures individual panel and component features—including X, Y, and Z positions, tilt, rotation angles, and 3D thickness.
- Expanded Inspection Area
Integrates profiler modules that cover an inspection area up to 66 mm × 50 mm for high-precision surface and profile analysis.
- High-Resolution Vision Hardware
Equipped with a 50MP mono area scan 2D camera (with optional extended resolution configurations up to 199MP and 428MP) delivering accuracy up to 5µm, alongside 3D profiler X-axis resolutions up to 8µm.
- Flexible Panel Handling
Accommodates varying sizes of panel boards ranging from 100 mm × 100 mm up to 450 mm × 320 mm, with thicknesses from 2 mm to 3 mm.
- Advanced Traceability & Lighting
Features optimized camera readability for 2D matrix barcodes supported by adjustable camera lighting configurations for varying placement locations.
- LED Packaging & Manufacturing
Widely used for inspecting advanced LED arrays and components to guarantee exact XYZ positioning, tilt, rotational alignment, and precise 3D thickness.
- PCB Substrate & Panel Inspection
Deployed for quality control on multi-layer PCB substrate panels and electronic component assemblies where strict dimensional tolerances are required.
- Surface-Mount Technology (SMT) & Component Metrology
Utilized in advanced electronics production lines to analyze component gaps, height variations, and structural defects that standard 2D systems cannot detect.
- Advanced Packaging & Solder Joint Verification
Applied to measure complex surface topographies, coplanarity, and package dimensions to ensure structural integrity before downstream assembly.
- Research, Development, and Quality Assurance Laboratories
Integrated into engineering and metrology labs for rigorous R&D testing, recipe creation, and detailed spatial profiling of micro-components.
Flowchart
The input conveyor transfers the panel from the upstream machine to the 3D profiler XY table.
The input claw moves the panel into position on the 3D profiler XY table. The 3D profiler XY table then moves the panel through 3D inspection.
The transfer claw moves the panel into position on the 2D vision XY table. The 2D vision XY table then moves the panel through 2D inspection.
The output claw moves the panel to the output conveyor. The output conveyor then transfers the panel to the downstream machine.
Panel Board
2D & 3D Vision
LED Position X
LED Position Y
LED Position R
Gap XY
Thickness
Tilt
Vision Specifications
| 2D Vision | ||||
| Camera | 50MP (Mono Area Scan) | |||
| Accuracy | Up to 5μm | |||
| FOV (H x V) | 73mm x 55mm | |||
| Magnification | 0.63X | |||
| 3D Profiler (Top & Bottom) | ||||
| Resolution | Z | Up to 5μm | ||
| X | 8μm | |||
| FOV | 13mm – 14.5mm | |||
Machine Specifications
| Products | Panel Board | |
| Specifications | Input: | Panel |
| Output: | Panel | |
| Vision Inspection | 2D Vision, 3D Profiler (Top & Bottom) | |
| UPH | 1.35k/ 150 panels (Depending on configuration and size) | |
| Footprint | 2100m (W) x 3800m (L) x 1850mm (H) | |
| Warranty | 1 year limited excluding wear and tear parts | |
Redefining Precision with Advanced 3D Measurement Machine Technology
In today’s world of high-precision engineering, measurement accuracy can make or break product quality. That’s where the 3D measurement machine proves its value — delivering microscopic precision and consistency that human inspection simply can’t achieve. Designed to meet the demands of industries such as automotive, aerospace, electronics, and tooling, this cutting-edge technology ensures that every component is crafted to exact specifications.
Our 3D measurement system combines laser scanning, optical sensors, and intelligent data processing to capture detailed 3D profiles with exceptional accuracy. By transforming physical dimensions into digital models, engineers can analyse complex geometries, verify tolerances, and improve production quality — all in real time. The system’s user-friendly interface and automated functions make it ideal for both research laboratories and industrial manufacturing environments.
At MMSIS, we bring years of metrology expertise and technical innovation to every solution. Each system is tested for performance stability and calibration reliability, giving clients the confidence to operate with absolute precision. From prototype development to large-scale production, our machines deliver the data integrity and repeatability that modern manufacturing demands.
Experience measurement without compromise. Discover how our 3D measurement machines can elevate your production standards — get in touch today to schedule a live demonstration.
FAQ
The LU168 is an advanced high-precision measurement and metrology system developed by MMS. It is exclusively designed to handle panel boards and inspect complex structural parameters like XYZ positioning, tilt, rotation, and 3D thickness.
It utilizes a modular vision system that integrates a high-resolution 2D camera with customizable 3D profiling capabilities. The system can be configured with a single 3D profiler for single-direction measurement or upgraded with optional dual 3D profilers (top and bottom) to eliminate blind spots and deliver comprehensive 3D spatial profiling.
The machine supports panel boards sized between 100 mm × 100 mm and 450 mm × 320 mm, with component thicknesses ranging from 2 mm to 3 mm.
The system measures a wide array of geometric and spatial criteria, including:
- LED / component positions across X, Y, and Z axes
- Rotational alignment and component tilt
- X and Y gap spacing between components
- Detailed 3D thickness and surface profiles
It is equipped with a 50MP mono area scan 2D camera (delivering up to 5µm accuracy) and 3D profilers offering Z-axis resolutions up to 5µm and X-axis resolution of 8µm. Optional extended 2D resolutions up to 199MP and 428MP are also available.
The machine delivers a processing capacity of approximately 1.35k / 150 panels, though actual speed varies depending on the specific configuration, panel size, and inspection recipe complexity.
