Modules
- Input Magazine Lifter
- XYθ Stage with Wafer Ring Holder
- Main Turret (24 Finger)
- 6S Vision Inspection
- Tape & Reel Output OR Output Magazine Lifter
- System Reject Bin
- 6-Sided Vision Inspection
Equipped with high-speed and high-accuracy cameras to perform comprehensive cosmetic and structural checks on the top, bottom, and all 4 sides of each die. - Flexible Wafer Format Compatibility
Seamlessly accommodates 6″, 8″, and 12″ wafer inputs through an easy-to-use conversion kit application. - High-Volume 12″ Wafer Sorting
Engineered to process up to 12″ wafer formats, delivering throughput rates up to 20,000 dice per hour for 2mm x 1mm die sizes. Actual sorting throughput varies depending on specific die dimensions and machine configuration. - Auto XY-Axis Alignment & Versatile Outputs
Integrates auto XY-axis positioning correction to enhance unit placement accuracy across multiple output formats, including 6″ and 8″ wafer ring outputs, bin tape, tape & reel (8, 12, and 16 mm widths), and waffle pack configurations. - Wide Die Size Viability
Built to handle a broad spectrum of die dimensions ranging from 1mm x 1mm up to 5mm x 5mm, with thickness capabilities down to 0.04mm with new ejector design The system supports multiple die inspections per grab and sorts wafer die by bin code, with multiple EMap file format extensions available (.A, .STIF, .ANAM). - Multi-Die Processing & Bin Sorting
Supports multi-die inspection per grab to optimize handling efficiency, automatically sorting wafer dice according to assigned bin codes. - Flexible EMap File Support
Compatible with multiple EMap file format extensions (including .A, .STIF, and .ANAM) to ensure seamless data integration with downstream MES and software environments.
- Semiconductor Backend Manufacturing & Packaging
Utilized in post-wafer-fab processing for handling, sorting, and packaging individual semiconductor dies after wafer slicing (dicing). - Advanced Quality Control & AOI (Automated Optical Inspection)
Deployed for rigorous 6-sided cosmetic and structural quality checks—detecting micro-cracks, edge burrs, chipping, and surface contamination on sensitive dies prior to final packaging. - Wafer-Level Chip Scale Packaging (WLCSP)
Applied in processing thin and ultra-thin semiconductor dies across various standard wafer diameters ($6″, 8″, and 12″$). - Optoelectronics & LED Production
Used for sorting and inspecting high-precision optical and optoelectronic components that demand strict surface defect criteria and exact spatial orientation. - High-Volume Tape & Reel Packaging Operations
Integrates directly into automated production lines to transition sorted, inspected dies seamlessly into tape & reel or wafer ring output formats for downstream surface-mount technology (SMT) assembly.
Flowchart
Magazine is loaded into the input. An empty magazine or carrier tape reel is loaded depending on the output format.
The input magazine lifter positions the magazine, and the wafer ring extractor pulls the wafer ring into the wafer ring holder.
The input flipper will index the unit, and the bottom vision inspects and transfers it to the main turret.
The main turret will index the unit through the top vision, contactless precisor, and 4-side vision station
If the unit is good, it will be placed into the output wafer or tape and reel; otherwise, it will be sent to the system reject bin.
For tape output, pocket vision inspects the unit inside the carrier tape, and seal vision inspects the sealing condition of the cover tape.
Advantages
- Sorting capacity – Up to 20K dice per hour (2mm x 1mm)
- Supports multiple die inspections per grab and sorts wafer die by bin code
- Built-in cosmetic inspection with 6-sided vision inspection (Top, Bottom, 4 Sides)
- Multiple EMap file format extensions available (.A, .STIF, .ANAM)
- Wide range of die size viability
- Die size – 1mm x 1mm to 5mm x 5mm
- Die thickness
- 0.1mm to 0.7mm
- 0.04mm (with new ejector design)
- Versatile Input:
- 6”, 8” and 12” width
- Auto Panel & Unit Alignment (with 3 Reference Points)
- Supports wafer input starting point from last stop location
- Versatile Output:
- Tape & Reel (8, 12, 16mm width)
- Wafer Ring (6″, 8″) / Bin Tape
- Auto XY-axis correction to improve output unit placement accuracy
Wafer Ring (6”- 8”, 12” with conversion kit)
Top, Bottom & 4S Inspection
Die Position
Die Crack
Edge Burr
Edge Debris
Cracked
Damaged Bump
Discoloration
Die Chipping
Vision Specifications
| Top & Bottom Station | ||
| Camera | 26.0MP | |
| Resolution | 5120 x 5120 | |
| Magnification | 1.5X | |
| FOV (H x V) (mm) | 8.53 x 8.53 | |
| Surface Chip-off, Surface Crack, Surface Contamination, Surface Scratch, Surface Dent | ||
| 4S Station | ||
| Camera | 3.2MP | |
| Resolution | 2048 x 1536 | |
| Magnification | 1.0X | |
| FOV (H x V) (mm) | 7.06 x 5.30 | |
| Side Surface Chip-off, Side Surface Crack | ||
| Aligner Station | ||
| Camera | 5.0MP | |
| Resolution | 2448 x 2048 | |
| Magnification | 1.0X | |
| FOV (H x V) (mm) | 8.45 x 7.06 | |
| Die Positon Recognition, Die Present | ||
| IN PR Station | ||
| Camera | 12.3MP | |
| Resolution | 4096 x 3000 | |
| Magnification | 0.35X to 1.0X | |
| FOV (H x V) (mm) | 36.88 x 27.01 to 12.90 x 9.45 | |
| Die Positon Recognition, Die Pattern & Orientation, Die Inked | ||
| Pocket / Waffle Pack Station | ||
| Camera | 5.0MP | |
| Resolution | 5.0MP | |
| Magnification | 0.7X to 1.0X | |
| FOV (H x V) (mm) | 18.44 x 13.50 to 12.90 x 9.45 | |
| Pocket Position Recognition | ||
Machine Specifications
| Products |
Wafer (6”, 8”, 12”)
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| Specifications | Input: | Magazine Loader (13/25 wafer ring slots) | |
| Output: | – Tape & Reel (8, 12, 16mm width) – Wafer Ring (6″, 8″) / Bin Tape |
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| Vision Inspection | 6S (top, bottom and 4 sides) | ||
| UPH | Up to 20K (Depending on configuration and die size) | ||
| Footprint | 2100mm (W) x 1900mm (L) x 1900mm (H) | ||
| Warranty | 1 year limited excluding wear and tear parts | ||
FAQ
The die sorter inspection machine picks up individual dies or microchips using a vacuum or other method and places them onto a wafer tape or tape and reels. The machine can also inspect and test each die before placing it, ensuring quality control and consistency in the packaging process.
Using a die sorter inspection machine can increase production efficiency, improve quality control, and reduce labor costs. The machine can also handle delicate and small components, which would be difficult or impossible to place manually.
When choosing a die sorter inspection machine, factors such as accuracy, speed, ease of use, and compatibility should be considered. The size and type of dies or microchips being sorted should also be taken it.
The mWW600 is an automated semiconductor backend processing system designed to handle a wide range of die sizes. Operating at the front-end wafer fabrication assembly, the system integrates high-accuracy vision inspection with precision pick-and-place automation. It picks and evaluates individual semiconductor dice after wafer dicing.
The machine features a versatile input setup that effortlessly handles 6-inch, 8-inch, and 12-inch wafers using an easy-to-use conversion kit application.
It performs a comprehensive 6-sided vision inspection utilizing high-speed, high-accuracy cameras. This checks the top, bottom, and all 4 sides of a die to detect structural and cosmetic flaws such as micro-cracks, edge chipping, surface contamination, scratches, and damaged bumps.
The mWW600 accommodates a wide range of die sizes from 1mm x 1mm up to 5mm x 5mm. Standard die thickness ranges from 0.1mm to 0.7mm, and can go as thin as 0.04mm utilizing an upgraded ejector design.
Depending on the specific configuration and die dimensions, the machine delivers a high sorting capacity of up to 20,000 dice per hour (UPH).
The equipment supports a versatile range of output formats, including 6-inch and 8-inch wafer ring outputs, bin tape, tape & reel (8 mm, 12 mm, and 16 mm widths), and waffle pack configurations, alongside a dedicated system reject bin for defective dice.
