Foreign Material
Edge Debris
Edge Burr
Die Crack
Die Position
Die Placement
Die Chip Off
Die Scratches
Glue Overflow
Missing Die
Wirebond
Wire Sweep
Missing Wire
Non-Stick on Pad (NSOP)
Non-Stick on Lead (NSOL)
Unbonded
Smashing Bond
Bond Offset
Double Bond
Bond Tail
Broken Wire
Applicable Products
| Camera | 5MP | 65MP | ||
| Accuracy | ± 7.0μm | ± 3.5μm | ||
| FOV (H x V)> | 8.4mm x 7.0mm | 14.9mm x 11.2mm | ||
| Magnification | 1X | 2X | ||
*Specification can be adjusted accordingly*
