Vibrator Bowl Input

Main Turret Station

The VN 200 is our high-speed rotary platform for all test and packaging options. The turret comes with 20 or 24 fingers, depending on the options chosen and the size of the unit. The standard setup with 4 test sites can be altered by opting for a laser marking, vision station, additional output module or optical test site.

In line with our high standards of quality, the VN200 is built to combine high-speed, accuracy, and reliability with low cost of ownership as well as flexibility of design. The VN200 handles semiconductor packages, like SOT, QFN and SOIC.

Features

  • Up to 4 parallel test sites for increased throughput of long-test-time devices
  • Active and passive precisors eliminate the risk of device damage for leaded and leadless packages
  • Dual-finger design of the vision table in/out enables higher UPH
  • Double-unit detection at test sites minimizes the risk of device damage

  • Servo motor-driven taping indexer for higher-speed indexing
  • Servo motor-driven sealing shoe for higher speed and consistent peel force
  • Minimal conversion time if the product is similar

Test Handler / VN200

Modules

  1. Input
    Vibrator Bowl
    Optional Tubes or Pallets
  2. Vision for Check Orientation
  3. Orientator
  4. Precisor
  5. Vision Station
    Laser marking
    Vision station
    Optical test site
  6. Tape & Reel Output

Features

The vibrator bowl input supports a wide range of products that are carried to the turret table.

The main turret table supports up to 20 or 24 turret fingers for high-speed testing.

Vision is used to check the unit orientation. Then the precisor and orientator correct the position for accurate testing.

Up to 4 parallel test sites allow for high throughput, even with long test times.

Products are placed in the pocket tape.
Optional: Tube output.

Products involved in the Automotive, General Lighting, Smart Devices and Semiconductor industry

LED

LED 3535

LED 5050

LED 3014

LED 5060

Lens

Smart Outline Integrated Package (SOIC)

IC Package

Surface Mount

Through Hole

Quad Flat No-Lead Package (QFN)

Sensor

Test Parameter

Optical Test Site

  • Contact Check
  • Forward Current
  • Reverse Voltage
  • Forward Voltage
  • Spectral Count
  • Luminous Flux
  • Spectral Magnitude
  • Spectral Wavelength
  • CIE_x
  • CIE_y
  • CIE_u
  • CIE_v
  • Color Temperature

Top & 4S Vision Inspection

Foreign Material

LensForeignMaterial

Weld Line

Weld

Scratches

Scratches

Chipping

ChipOff2

Cracked

Crack3

Dents

Dent3

Deformation

Deform2

Flash

EjectorPinFlash2

Vision Specification

Top 
Camera 1.3MP (Mono)
Accuracy 15μm
FOV (H x V) ~ (7.5×5.9) mm
Magnification 0.8X
4S Vision
Camera 5MP (Mono)
Accuracy 12μm
FOV (H x V) ~ (12.79×10.7) mm
Magnification 0.66

Machine Specification

Products Lens, Sensor, SOIC, IC package, QFN, LED, etc
Specifications Input: Bowl or Tube
Output: Tape and Reel, or Tube
Test Site Single, Dual, Quad
Laser Mark Option for Laser Integration
UPH 40K + (Depending on client product)
Vision Inspection 2D Mark/Orientation
3D Leads Co-planarity
2D in Pocket (Tape)
2D Pad
Footprints 1720mm(W) x 2125mm (L)
Warranty 1 year limited excluding wear and tear parts