Vibrator Bowl Input

Main Turret Station

The VN 200 is our high-speed rotary platform for all test and packaging options. The turret comes with 20 or 24 fingers, depending on the options chosen and the size of the unit. The standard setup with 4 test sites can be altered by opting for a laser marking, vision station, additional output module or optical test site.
In line with our high standards of quality, the VN200 is built to combine high-speed, accuracy, and reliability with low cost of ownership as well as flexibility of design. The VN200 handles semiconductor packages, like SOT, QFN and SOIC.
Features
- Up to 4 parallel test sites for increased throughput of long-test-time devices
- Active and passive precisors eliminate the risk of device damage for leaded and leadless packages
- Dual-finger design of the vision table in/out enables higher UPH
-
Double-unit detection at test sites minimizes the risk of device damage
- Servo motor-driven taping indexer for higher-speed indexing
- Servo motor-driven sealing shoe for higher speed and consistent peel force
- Minimal conversion time if the product is similar
Test Handler / VN200

Modules
- Input
Vibrator Bowl
Optional Tubes or Pallets - Vision for Check Orientation
- Orientator
- Precisor
- Vision Station
Laser marking
Vision station
Optical test site - Tape & Reel Output
Features

The vibrator bowl input supports a wide range of products that are carried to the turret table.

The main turret table supports up to 20 or 24 turret fingers for high-speed testing.

Vision is used to check the unit orientation. Then the precisor and orientator correct the position for accurate testing.

Up to 4 parallel test sites allow for high throughput, even with long test times.

Products are placed in the pocket tape.
Optional: Tube output.
Products involved in the Automotive, General Lighting, Smart Devices and Semiconductor industry
LED
LED 3535

LED 5050

LED 3014

LED 5060

Lens


Smart Outline Integrated Package (SOIC)


IC Package
Surface Mount

Through Hole

Quad Flat No-Lead Package (QFN)

Sensor

Test Parameter

Optical Test Site
- Contact Check
- Forward Current
- Reverse Voltage
- Forward Voltage
- Spectral Count
- Luminous Flux
- Spectral Magnitude
- Spectral Wavelength
- CIE_x
- CIE_y
- CIE_u
- CIE_v
- Color Temperature
Top & 4S Vision Inspection
Foreign Material

Weld Line

Scratches

Chipping

Cracked

Dents

Deformation

Flash

Vision Specification
| Top | ||
| Camera | 1.3MP (Mono) | |
| Accuracy | 15μm | |
| FOV (H x V) | ~ (7.5×5.9) mm | |
| Magnification | 0.8X | |
| 4S Vision | ||
| Camera | 5MP (Mono) | |
| Accuracy | 12μm | |
| FOV (H x V) | ~ (12.79×10.7) mm | |
| Magnification | 0.66 | |
Machine Specification
| Products | Lens, Sensor, SOIC, IC package, QFN, LED, etc | |
| Specifications | Input: | Bowl or Tube |
| Output: | Tape and Reel, or Tube | |
| Test Site | Single, Dual, Quad | |
| Laser Mark | Option for Laser Integration | |
| UPH | 40K + (Depending on client product) | |
| Vision Inspection | 2D Mark/Orientation 3D Leads Co-planarity 2D in Pocket (Tape) 2D Pad |
|
| Footprints | 1720mm(W) x 2125mm (L) | |
| Warranty | 1 year limited excluding wear and tear parts | |






























