Semi-Auto Wafer Defect Inspection Machine | WI400

Revolutionize the efficiency and flexibility of top vision inspection with WI400 Wafer Defect Inspection Machine to cater a range of industries, including LED lighting, semiconductor, and automation.

Armed with high-resolution camera, this wafer inspection system can inspect wafer components in the range of 5MP to 25MP mono/colour camera imaging technology based on your precision needs. For added reliability, the WI400 employs a confocal displacement sensor for warpage detection, offering height compensation of up to 2mm. This ensures your wafers maintain integrity throughout the inspection process.

Introduction

Manual Table Input

Top Vision Inspection

WI 400 Semi Auto Wafer Inspection is designed to deliver the utmost flexibility to support top vision inspection for fabricated components on wafer such as lens, LED & IC packages from 4” tiles to 8” wafer. With unique blend of flexibility and high performance, it makes an ideal inspection solution for automation industry.

Download PDF

Advantages

Features

Equipped with high-resolution camera
- Selection from 5MP to 25MP mono/colour camera imaging technology
Integrated techniques
- Colour inspection, normalized correlation and rule-based algorithms
Software alignment function
- Adjust wafer alignment angle for top vision inspection
Real time wafer map display
- All inspection information like mapping map, defect region, inspection result is visualized for easy reading
Support common wafer map output format
- STIF files
SPC statistical tool to monitor yield trend/ defect breakdown
Minimum detectable defect size 15 μm x 15 μm
Confocal displacement sensor for warpage detection. Height compensation up to 2mm

Machine Overview

SEMI AUTO WAFER INSPECTION / WI400

Modules

Input
XY Table
OCR Vision
To capture entire wafer product code for e-map processing
Top Vision Inspection Module

Flow Chart

Flowchart

Wafer placed on XY table for initial positioning in wafer inspection machine

The product is manually placed on top of the XY table. The table then carries the product to the OCR vision test site.

OCR system in wafer inspection machine reading wafer identification code

OCR vision reads the code on the wafer in order to record the result for the wafer to be loaded, preventing the result from being lost.

Real-time mapping results from wafer inspection machine during top vision analysis

XY offset is corrected before top vision inspection. Real-time wafer mapping results are displayed as the inspection is running.

Wafer inspection machine XY table returning to unload position after inspection

Once complete, the table moves back to the load/unload position, and the product can be safely unloaded.

Applicable Products

Bare Wafer

Wafer

Wafer Ring

Semiconductor wafer ring on carrier for inspection machine

Patterned wafer ring positioned for inspection process

Inspection Criteria

Top Inspection

Foreign Material

Stains

Stain defect identified on wafer surface during inspection

Scratches

Chipping

Cracked

Die inspection reveals a red fracture across the surface

Damaged Bump

Die inspection detects blackened or missing bumps

Discoloration

Lifted Metal

Measuring

Measurement check performed by wafer inspection equipment

Un-separation

Un-separated area on wafer detected during top inspection

Specification

Products	6” bare wafer or 8” wafer ring
Specifications	Input:	Bare wafer, Wafer rings
	Output:	Tiles, Wafer, Wafer rings
UPH	10K (depending on user product)
Vision Inspection	Cosmetic
Footprint	1250mm(W) x 1600mm(L) x 2100mm(H)
Warranty	1 year limited excluding wear and tear parts

What is wafer inspection?

Wafer inspection is a process used to detect defects. The process involves the use of specialized equipment and techniques to scan the surface of the wafer and identify any defects.

Why is wafer inspection important?

Wafer inspection is important because it helps to ensure the quality and reliability of electronic components. Defects in the silicon wafers can cause failures in the final products, which can lead to costly recalls and affect a company's reputation.

What types of defects can be detected through wafer inspection?

Wafer inspection can detect a wide range of defects, including scratches, particles, pattern defects, contamination, and other anomalies that may affect the performance or reliability of the final product.