LED Array Binning | AB330
LED Array Binning | AB330 - Image 2
LED Array Binning | AB330 - Image 3
LED Array Binning | AB330 - Image 4

LED Array Binning | AB330

The AB330’s core functionality and processes are punch & die singulation, and tested & mapped product sorting. The punch & die module can also be used for pre-test singulation. Designed specifically with metal-core product carriers (such as PCBs or lead frames) in mind, this system provides excellent coverage for your LED production needs.

A wide range of press sizes is also available for the singulation process, featuring options that include laser marking, 2D unit/lead frame ID reading, and cosmetic vision inspection. The sorting unit can be designed and built to better fit your needs, such as with a 32-tube drawer and an additional motorized drawer for seamless product removal by the operator.

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Applicable Products

LEDs in Arrays

Specification

Machine Specifications

Products LEDs in Arrays
Specifications Input: Array via Conveyor (SMEMA)
Output: Tubes
Laser Marking High-end Nd:YVO4 laser
Vision Inspection Orientation, Marking
UPH 100 substrates (depending on user product & orientation)
Footprint 2100m (W) x 2640m (L) x 2000mm (H)
Warranty 1 year limited excluding wear and tear parts

Advantages

Features

  • Fully automated laser marking, singulation, and sorting machine for LED arrays
  • Wide range of press sizes available; in-house die set design and production
  • Array input from conveyor or magazine (SMEMA standard)
  • Number of bins dependent on product, e.g., 2×32 bins
  • Two bin drawers allow safe product removal without machine stop
  • Fast and easy conversion of singulation die set (SMED design) — under 10 minutes