Die Sorter Inspection Machine | mWW600

In the realm of cutting-edge semiconductor technology, the mWW600 Die Sorter Inspection Machine emerges as a pinnacle of innovation. The mWW600 Die Sorter Machine is not just a masterful performance in operation; it is a celebration of versatility. Seamlessly integrating high-speed automation and precise vision, it is tailor-made to be a viable pick for a wide range of die sizes.

With an astute focus on commonly utilized wafer formats, the mWW600 solidifies its position as the quintessential inspection solution for the industry through its outstanding versatility, ensuring the efficiency and precision of die sortInput magazine litter positions the magazine and wafer ring extractor will pull the water ring into wafer ring holder.azine positioning and the movements of the main turrets. Notably, its flexibility shines as it effortlessly conducts 6-sided vision inspections utilizing high-speed and high-accuracy cameras on 6″, 8″, and even 12″ wafers through an easy-to-use conversion kit application. This remarkable machine supports 6″ and 8″ wafer outputs, in addition to tape & reel output format.

Machine Overview

Modules

Input Magazine Lifter
XYθ Stage with Wafer Ring Holder
Main Turret (24 Finger)
6S Vision Inspection
Tape & Reel Output OR Output Magazine Lifter
System Reject Bin

Flow Chart

Flowchart

Magazine is loaded into the input. An empty magazine or carrier tape reel is loaded depending on the output format.

The input magazine lifter positions the magazine, and the wafer ring extractor pulls the wafer ring into the wafer ring holder.

Die Inspection | Initial Inspection & Transfer

The input flipper will index the unit, and the bottom vision inspects and transfers it to the main turret.

The main turret will index the unit through the top vision, contactless precisor, and 4-side vision station

Die Inspection | Sorting Based on Inspection

If the unit is good, it will be placed into the output wafer or tape and reel; otherwise, it will be sent to the system reject bin.

Die Inspection | Main Turret Inspection Sequence

For tape output, pocket vision inspects the unit inside the carrier tape, and seal vision inspects the sealing condition of the cover tape.

Advantages

Features

Sorting capacity – Up to 20K dice per hour (2mm x 1mm)
Supports multiple die inspections per grab and sorts wafer die by bin code
Built-in cosmetic inspection with 6-sided vision inspection (Top, Bottom, 4 Sides)
Multiple EMap file format extensions available (.A, .STIF, .ANAM)
Wide range of die size viability
- Die size – 1mm x 1mm to 5mm x 5mm
- Die thickness
  - 0.1mm to 0.7mm
  - 0.04mm (with new ejector design)
Versatile Input:
- 6”, 8” and 12” width
- Auto Panel & Unit Alignment (with 3 Reference Points)
- Supports wafer input starting point from last stop location
Versatile Output:
- Tape & Reel (8, 12, 16mm width)
- Wafer Ring (6″, 8″) / Bin Tape
- Auto XY-axis correction to improve output unit placement accuracy

Applicable Products

Wafer Ring (6”- 8”, 12” with conversion kit)

Wafer ring with protective blue dicing tape

Inspection Criteria

Top, Bottom & 4S Inspection

Die Position

Die inspection detects misaligned die highlighted in red

Die Crack

Die inspection reveals a red fracture across the surface

Edge Burr

Edge Debris

Die inspection identifies red debris near the corner

Cracked

Damaged Bump

Die inspection detects blackened or missing bumps

Discoloration

Die Chipping

Die inspection finds chipped or broken corners

Specification

Vision Specifications

Top & Bottom Station
Camera	26.0MP
Resolution	5120 x 5120
Magnification	1.5X
FOV (H x V) (mm)	8.53 x 8.53
Surface Chip-off, Surface Crack, Surface Contamination, Surface Scratch, Surface Dent
4S Station
Camera	3.2MP
Resolution	2048 x 1536
Magnification	1.0X
FOV (H x V) (mm)	7.06 x 5.30
Side Surface Chip-off, Side Surface Crack
Aligner Station
Camera	5.0MP
Resolution	2448 x 2048
Magnification	1.0X
FOV (H x V) (mm)	8.45 x 7.06
Die Positon Recognition, Die Present
IN PR Station
Camera	12.3MP
Resolution	4096 x 3000
Magnification	0.35X to 1.0X
FOV (H x V) (mm)	36.88 x 27.01 to 12.90 x 9.45
Die Positon Recognition, Die Pattern & Orientation, Die Inked
Pocket / Waffle Pack Station
Camera	5.0MP
Resolution	5.0MP
Magnification	0.7X to 1.0X
FOV (H x V) (mm)	18.44 x 13.50 to 12.90 x 9.45
Pocket Position Recognition

Machine Specifications

Products	Wafer (6”, 8”, 12”) Die Size (1mm x 1mm to 5mm x 5mm) Die thickness (0.1mm to 0.7mm, 0.04mm with new ejector design)
Specifications	Input:	Magazine Loader (13/25 wafer ring slots)
	Output:	– Tape & Reel (8, 12, 16mm width) – Wafer Ring (6″, 8″) / Bin Tape
Vision Inspection	6S (top, bottom and 4 sides)
UPH	Up to 20K (Depending on configuration and die size)
Footprint	2100mm (W) x 1900mm (L) x 1900mm (H)
Warranty	1 year limited excluding wear and tear parts

How does a die sorter inspection machine work?

The die sorter inspection machine picks up individual dies or microchips using a vacuum or other method and places them onto a wafer tape or tape and reels. The machine can also inspect and test each die before placing it, ensuring quality control and consistency in the packaging process.

What are the benefits of using a die sorter inspection machine?

Using a die sorter inspection machine can increase production efficiency, improve quality control, and reduce labor costs. The machine can also handle delicate and small components, which would be difficult or impossible to place manually.

What factors should be considered when choosing a die sorter inspection machine?

When choosing a die sorter inspection machine, factors such as accuracy, speed, ease of use, and compatibility should be considered. The size and type of dies or microchips being sorted should also be taken it.