3D Profiler System for Surface Topography and Height Measurement in Precision Manufacturing
3D Profiler System - Image 2

3D Profiler System

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Applicable Products

Applicable product for Top or Bottom vision inspection system
applicable products for top or bottom vision inspection system
Applicable Products for Top or Bottom vision inspection system
Camera 3D Profiler
Accuracy ± 13μm
FOV (H x V)> 110.0mm x 85.0mm
Resolution X 90.0μm – 130.0μm
Z 21.0μm – 32.0μm

*Specification can be adjusted accordingly*

Inspection Criteria

Wavy Edge

Wavy Part

Burr

Package

Applicable Products

High-power round LED module with clear lens
Hexagonal yellow LED chip suitable for automated optical inspection
White plastic electrical connector, a molding part type processed by the Glass Turret AOI Machine for dimensional and cosmetic checks.
Assortment of colored through-hole LEDs, representing components verified by the Glass Turret AOI Machine during multi-angle inspection.
Area Scan
Camera 5MP 12MP
Accuracy ± 15.0μm ± 3.5μm
FOV (H x V)> 16.8mm x 14.1mm 7.0mm x 5.1mm
Magnification 0.5X 2X

*Specification can be adjusted accordingly*

Scratch

Dents

Ejection Pin Protrusion

Weld Line

Short Mold

Deformation

Foreign Material/ Stain/ Contaminant

Gate Vestige

Epoxy Bond Line

Glass Chip-Off /Crack Line

Incomplete Mold

Missing Plating

Over Plating

Plating Protusions

Discoloration

Flash/ Burr

Bumps Air/ Gas Trap Protruding

Window Offset

Air/ Gas Trap

Phospor Offset

Sink Mark

Missing Component

Beam Block Offset

Air/ Gas Trap

Phospor Offset

Mixed Parts

Wafer

Applicable Products

Camera 5MP 65MP
Accuracy ± 7.0μm ± 3.5μm
FOV (H x V)> 8.4mm x 7.0mm 14.9mm x 11.2mm
Magnification 1X 2X

*Specification can be adjusted accordingly*

Foreign Material

Detection of foreign material on wafer using wafer inspection machine

Edge Debris

Edge Burr

Die Crack

Die inspection reveals a red fracture across the surface

Die Position

Die Placement

Un-separated area on wafer detected during top inspection

Die Chip Off

Edge chipping found during wafer top inspection

Die Scratches

Glue Overflow

Missing Die

Wirebond

Applicable Products

Camera 5MP 65MP
Accuracy ± 7.0μm ± 3.5μm
FOV (H x V)> 8.4mm x 7.0mm 14.9mm x 11.2mm
Magnification 1X 2X

*Specification can be adjusted accordingly*

Wire Sweep

Missing Wire

Non-Stick on Pad (NSOP)

Non-Stick on Lead (NSOL)

Unbonded

Smashing Bond

Bond Offset

Double Bond

Bond Tail

Broken Wire