Modules

  1. Input/Output Wafer Cassette Station
  2. Dual-Arm Wafer Robot
  3. XYZθ Stage
  4. Aligner Vision Inspection
  5. Auto Focus Top Vision Inspection
  6. Bottom Vision Inspection

Flowchart

Wafer robot carries wafer onto xyzθ stage to perform aligner vision inspection after its mapping sensor determines the status of wafer insertion in the input cassette.

The xyzθ stage transfers wafer under top vision for defects inspection after align position and orientation of wafer.

Right robot arm transfers inspected wafer to bottom vision’s stage while left robot arm simultaneously loads next wafer to vision aligner’s stage.

The xyzθ stage transfers inspected wafer under bottom vision for defects inspection.

Wafer robot unload fully inspected wafer into output cassette.

Inspection result will be display on monitor during top and bottom inspection process.

Features

  • Versatile Product Support Compatibility
    • Supports 4” to 12” wafer and 4” to 8” wafer frame
    • Die/Chip size: 76–1770μm, Die thickness: 75–750μm
  • Customizable Top & Bottom Vision Inspection
    • Multiple camera selection options to match die sizes for precise inspection
    • High-precision 4 objective lens turret for superior accuracy and flexible FOV
  • Advanced Vision Aligner System
    • Detects and corrects wafer position and angle for optimal alignment
  • Configurable xyzθ Stage
    • Convertible minimum-contact vacuum chuck for sensitive wafer handling
    • Bottom vision inspection capability on the xyzθ stage
    • Attachable glass option for inspecting sensitive thin wafers
    • Support various end effector forks
    • 360° rotary for vision aligner
  • Dual-Arm Wafer Robot
    • Wide range of optional end effector & mapping sensor is available
  • Flexible Input/Output Cassette System
    • Up to 4 cassettes for 6” & 8” wafers/wafer frames
    • Up to 2 cassettes for 12” wafers

Bare Wafer / Wafer / Wafer Frame

Wafer ring with protective blue dicing tape

Top Vision Inspection

Wafer Defects

Wafer Frame Defects

Bottom Vision Inspection

Wafer Defects

Wafer Frame Defects

Vision Specifications

Aligner Vision
Camera 2K Line Scan Mono
 FOV (H x V) ~17mm (H)
Magnification 1X Telecentric Lens
Accuracy ±20μm
Min. Detectability ~40μm
Inspection Criteria Inspection orientation in xy0 (Flat and Notch)
Top Vision
Camera 25MP Area Scan Color
 FOV (H x V) 0.65~5.1mm x 0.64~5.1mm
Magnification Lens Turret with 4 Objective Lens: 2.5X, 5X, 10X, 20X (Customisable)
Accuracy ±10μm, ±5μm, ±2.5μm, ±2μm
Min. Detectability ~20μm, ~10μm, ~5μm, ~4μm
Inspection Criteria Wafer (No Dicing)
a. Scratch/Crack
b. Discolouration
c. Wafer Broken
d. Contamination/Dirt
Wafer Frame (Dicing – Singulated)
a. Chipping
b. Scratch/Crack
c. Discolouration
d. Cut Inspection (No Cut/Half-Cut/Cut Position)
e. Bump Size (Diameter)
f. Contamination/Dirt
Bottom Vision
Camera 25MP Area Scan Color
 FOV (H x V) 6.4mm x 6.4mm
Magnification 2X Telecentric Lens
Accuracy ±5μm
Min. Detectability ~10μm
Inspection Criteria Wafer (No Dicing)
a. Scratch/Crack
b. Discolouration
c. Wafer Broken
d. Contamination/Dirt
Wafer Frame (Dicing – Singulated)
a. Scratch/Crack
b. Wafer Broken
c. Contamination/Dirt

Machine Specifications

Products Wafer 4” to 12” wafer
Wafer Frame 4” to 8” wafer frame
Die Chip Size: 76~1770μm
Thickness: 75~750μm
Wafer Robot Arms Quantity Dual Arm ( Optional: Single Arm only)
Ends Effector Non-contact Bernoulli / Non-contact Edge Grip/ Vacuum / Passive-edge Holding / Porous / Gripper
Input Output Cassette
Size & Quality
4”, 6”, 8” Wafer/Wafer Frame: 2~4 Input Output Cassette
12” Wafer: 1~2 Input Output Cassette
Top & Bottom Vision Inspection  Objective Lens / Telecentric Lens
xyθ Stage Vacuum Chuck
(Top & Bottom
Vision Inspection)
Kit 1: 4” Wafer
Kit 2: 6” Wafer & 4” Wafer Frame
Kit 3: 8” Wafer & 6” Wafer Frame
Kit 4: 12” Wafer & 8” Wafer Frame
Rated Wafer Per Hour 4”: 70 WPH 6”: 30 WPH 8”: 15 WPH 12”: 6 WPH
Footprint 2200mm (W) x 2200mm (L) x 2000mm (H)
Warranty 1 year limited excluding wear and tear parts

Auto Focus Wafer Inspection Machine for Reliable Bare Wafer Inspection

In semiconductor manufacturing, small defects on bare wafers or frames can quickly turn into yield loss, rework, and unplanned downtime. An auto focus wafer inspection machine ensures consistent, repeatable bare wafer inspection by automatically optimising focus and image quality for each die and frame area. This helps process and QA teams maintain stable quality standards, especially in high-mix, high-volume environments.

The system is designed to tackle the real-world quality issues that often slip through traditional inspection:

  • Wafer defects (top and bottom vision)

incomplete die, scratches, contamination, Au residue, and other surface irregularities.

  • Wafer frame defects (top vision)

incomplete cuts, cut position shift, double cuts, scratches, no cut, contamination, cracks.

  • Wafer frame defects (bottom vision)

over cuts, cutting line issues, dirty or contaminated frame areas.

By consolidating these inspections into one automated wafer inspection machine, manufacturers can reduce escapes, improve first-pass yield, and react faster to process drift.

 

Why Choose This Auto Focus Wafer Inspection Machine

This platform stands out by combining customisable, AI-ready vision inspection with intelligent material handling. Moreover, multiple camera options allow the vision system to be matched to different die sizes and thicknesses, while inspection settings can be fine-tuned for each product. Its architecture is designed for AI integration, enabling advanced defect detection, classification, and trend analysis to enhance the consistency of bare wafer inspection over time.

At the same time, a configurable xyzθ stage with a minimum-contact vacuum chuck positions wafers at the ideal angle and height, supports thin and sensitive wafers, and allows bottom vision inspection directly on the stage for better repeatability. This is complemented by a dual robot arm configuration with flexible end effector and mapping options, as well as multiple input/output cassette configurations for various wafer and frame sizes. Together, these features make this auto focus wafer inspection machine a robust and scalable choice for fabs and OSATs that need stable, high-quality bare wafer inspection.