Wafer Wire Bond Inspection Machine | WI300

Unlock a new level of quality assurance with the WI300 Wafer Wire Bond Inspection Machine. With a unique blend of flexibility and high performance, the WI300 Wire Bond Inspection Machine is an ideal vision inspection system for fabricated components on wafers.

This automatic wire bonding machine offers unparalleled precision with its high-resolution camera technology, capable of scrutinizing every aspect of components, including lenses, LEDs, and IC packages on 4” tiles to 6” wafers. Built with real-time insights, its comprehensive inspection—from mapping maps to defect region results—is visualized for effortless interpretation, covering wafer die, wire bond, and cosmetic checks. With adaptive features like auto-alignment, Position Recognize (PR) vision, and confocal displacement sensors, it accommodates varying production needs, including warpage detection and height compensation of up to 2mm.